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Priced by quantity and lead time.
Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Terminal Formu
- BALL
- Seated Heightmax
- 2.59 mm
- Part Life Cycle Code
- Transferred
- Terminal Kaplaması
- TIN SILVER COPPER
- Package Description
- BGA,
- Number Of Terminals
- 360
- Package Style
- GRID ARRAY
- Boundary Scan
- YES
- Address Bus Width
- 26
- Terminal Pozisyonu
- BOTTOM
- JESD-609 Kodu
- e1
- Jesd30 Code
- S-PBGA-B360
- REACH Uyumluluk Kodu
- compliant
- Rohs Code
- Yes
- Pin Sayısı
- 360
- Package Shape
- SQUARE
- External Data Bus Width
- 32
- Integrated Cache
- YES
- Speed
- 416 MHz
- Package Body Material
- PLASTIC/EPOXY
- Qualification Status
- Not Qualified
- Supply Voltagemin
- 1.2825 V
- Package Code
- BGA
- Genişlik
- 23 mm
- Tepe Reflow Sıcaklığı (°C)
- 260
- Low Power Mode
- YES
- Üretici Parça No
- NHPXA270C0C416
- Ihs Manufacturer
- INTEL CORP
- Uzunluk
- 23 mm
- Supply Voltagemax
- 1.705 V
- Format
- FIXED POINT
- Clock Frequencymax
- 13.002 MHz
- Reflow Temperaturemax S
- 40
- Yüzey Montaj
- YES
- Upsucsperipheral Ics Type
- MICROPROCESSOR, RISC
- Supply Voltagenom
- 1.35 V
- Risk Rank
- 5.51
- Part Package Code
- BGA
- Terminal Adımı
- 1 mm
- Technology
- CMOS