GCIXF1002ED

Specifications

Boundary Scan

YES

Temperature Grade

COMMERCIAL

Part Package Code

BGA

Ihs Manufacturer

INTEL CORP

Reflow Temperaturemax S

NOT SPECIFIED

Jesd30 Code

S-PBGA-B304

REACH Uyumluluk Kodu

compliant

Seated Heightmax

1.67 mm

Package Shape

SQUARE

HTS Kodu

8542.31.00.01

Data Transfer Ratemax

125 MBps

External Data Bus Width

16

Yüzey Montaj

YES

Tepe Reflow Sıcaklığı (°C)

NOT SPECIFIED

Package Description

LBGA, BGA304,23X23,50

Technology

CMOS

Risk Rank

8.74

Package Style

GRID ARRAY, LOW PROFILE

Ambalaj

Bulk

Package Equivalence Code

BGA304,23X23,50

Part Life Cycle Code

Obsolete

Terminal Pozisyonu

BOTTOM

RoHS

Non-Compliant

Pin Sayısı

304

Number Of Serial Ios

2

Operating Temperaturemax

70 °C

Supply Voltagemax

3.6 V

Qualification Status

Not Qualified

Supply Voltagemin

3 V

Uzunluk

31 mm

Number Of Terminals

304

Package Body Material

PLASTIC/EPOXY

Low Power Mode

NO

Rohs Code

No

Address Bus Width

10

Power Supplies

3.3,3.3/5 V

Package Code

LBGA

Genişlik

31 mm

Terminal Adımı

1.27 mm

Clock Frequencymax

85 MHz