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C3 ChipZentronix

Intel

AGFA008R16A2E4X

SoC

RoHS: Compliant

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Specifications

Paket
Tray
Renk
Clear
Peripherals
DMA, WDT
Tip
TUBING
Inside Diameter After Shrinking
0.64
Seri
Agilex F
Ürün Durumu
Active
Architecture
MPU, FPGA
Shrink Ratio
3:1
Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Inside Diameter Before Shrinking
1.98
Speed
1.4GHz
Primary Attributes
FPGA - 764K Logic Elements
Product Thickness
0.41
Connectivity
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Çalışma Sıcaklığı
0°C ~ 100°C (TJ)
Body Material
Polyolefin
Ram Size
256KB
Number Of Ios
384

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