IS35ML02G081-BLA2

Specifications

Operating Temperaturemax

105 °C

Page Size

2K words

Part Life Cycle Code

Active

Standby Currentmax

0.00005 A

Jesd30 Code

R-PBGA-B63

Fonksiyon Sayısı

1

Operating Mode

ASYNCHRONOUS

Terminal Adımı

0.8 mm

Parallelserial

PARALLEL

Package Equivalence Code

BGA63,10X12,32

Memory Density

2147483648 bit

Data Retention Timemin

10

Number Of Sectorssize

2K

Rohs Code

Yes

Package Shape

RECTANGULAR

Number Of Words Code

256000000

Risk Rank

5.78

Terminal Formu

BALL

Yüzey Montaj

YES

Sector Size

128K

Tip

SLC NAND TYPE

Uzunluk

11 mm

Organization

256MX8

Endurance

100000 Write/Erase Cycles

Package Style

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Package Code

VFBGA

Write Protection

HARDWARE

REACH Uyumluluk Kodu

compliant

Toggle Bit

NO

Number Of Words

268435456 words

Supply Currentmax

0.03 mA

Usage Level

Automotive grade

Screening Level

AEC-Q100

Readybusy

YES

Operating Temperaturemin

-40 °C

Ihs Manufacturer

INTEGRATED SILICON SOLUTION INC

Package Body Material

PLASTIC/EPOXY

Supply Voltagemin Vsup

2.7 V

Number Of Terminals

63

Memory Ic Type

FLASH