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Priced by quantity and lead time.
Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Temperature Grade
- INDUSTRIAL
- Package Style
- GRID ARRAY, THIN PROFILE
- Fonksiyon Sayısı
- 1
- Memory Density
- 536870912 bit
- Memory Width
- 8
- Operating Temperaturemin
- -40 °C
- Jesd30 Code
- R-PBGA-B24
- Number Of Words
- 67108864 words
- Parallelserial
- SERIAL
- Terminal Adımı
- 1 mm
- Number Of Words Code
- 64000000
- Rohs Code
- Yes
- Ihs Manufacturer
- INTEGRATED SILICON SOLUTION INC
- Supply Voltagemin Vsup
- 2.3 V
- Terminal Pozisyonu
- BOTTOM
- Alternate Memory Width
- 1
- Package Shape
- RECTANGULAR
- Seated Heightmax
- 1.2 mm
- Memory Ic Type
- FLASH
- Supply Voltagemax Vsup
- 3.6 V
- Organization
- 64MX8
- Supply Voltagenom Vsup
- 3 V
- Programming Voltage
- 3 V
- Operating Mode
- SYNCHRONOUS
- Üretici Parça No
- IS25LP512M-TGLE-TR
- Clock Frequencymax Fclk
- 133 MHz
- Operating Temperaturemax
- 105 °C
- Risk Rank
- 5.71
- Yüzey Montaj
- YES
- REACH Uyumluluk Kodu
- compliant
- Genişlik
- 6 mm
- Tepe Reflow Sıcaklığı (°C)
- NOT SPECIFIED
- Package Body Material
- PLASTIC/EPOXY
- Reflow Temperaturemax S
- NOT SPECIFIED
- Package Description
- TBGA,
- Terminal Formu
- BALL
- Number Of Terminals
- 24
- Package Code
- TBGA
- Uzunluk
- 8 mm
- Part Life Cycle Code
- Active