Request a quote for pricing
Priced by quantity and lead time.
Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Package Body Material
- PLASTIC/EPOXY
- Ihs Manufacturer
- INTEGRATED SILICON SOLUTION INC
- Number Of Words Code
- 4000000
- JESD-609 Kodu
- e1
- Seated Heightmax
- 1.2 mm
- Üretici Parça No
- IS25LP032D-RGLE
- Jesd30 Code
- R-PBGA-B24
- Memory Density
- 33554432 bit
- Genişlik
- 6 mm
- Yüzey Montaj
- YES
- Clock Frequencymax Fclk
- 133 MHz
- Terminal Kaplaması
- Tin/Silver/Copper (Sn/Ag/Cu)
- Fonksiyon Sayısı
- 1
- Operating Mode
- SYNCHRONOUS
- Uzunluk
- 8 mm
- Risk Rank
- 5.55
- Terminal Formu
- BALL
- Supply Voltagemax Vsup
- 3.6 V
- Supply Voltagenom Vsup
- 3 V
- Terminal Adımı
- 1 mm
- Number Of Words
- 4194304 words
- Number Of Terminals
- 24
- Terminal Pozisyonu
- BOTTOM
- Operating Temperaturemax
- 105 °C
- Organization
- 4MX8
- Reflow Temperaturemax S
- NOT SPECIFIED
- Programming Voltage
- 3 V
- Rohs Code
- Yes
- Parallelserial
- SERIAL
- Tepe Reflow Sıcaklığı (°C)
- NOT SPECIFIED
- Package Shape
- RECTANGULAR
- Supply Voltagemin Vsup
- 2.3 V
- Package Description
- TFBGA-24
- REACH Uyumluluk Kodu
- compliant
- Temperature Grade
- INDUSTRIAL
- Package Style
- GRID ARRAY, THIN PROFILE
- Operating Temperaturemin
- -40 °C
- Memory Width
- 8
- Part Life Cycle Code
- Active
- Memory Ic Type
- FLASH