IS75V16F64GS32-7070DI

Specifications

Package Equivalence Code

BGA65,10X10,32

Terminal Formu

BALL

Number Of Words

4194304 words

Part Life Cycle Code

Obsolete

ECCN Kodu

EAR99

Genişlik

9 mm

REACH Uyumluluk Kodu

compliant

Number Of Words Code

4000000

Operating Temperaturemax

85 °C

Kurşunsuz Kodu

No

Part Package Code

BGA

Supply Voltagenom Vsup

2.9 V

Rohs Code

No

Qualification Status

Not Qualified

Mixed Memory Type

FLASH+SRAM

Yüzey Montaj

YES

Uzunluk

9 mm

JESD-609 Kodu

e0

Operating Mode

ASYNCHRONOUS

Ihs Manufacturer

INTEGRATED SILICON SOLUTION INC

Supply Voltagemin Vsup

2.7 V

Package Description

9 X 9 MM, 0.80 MM PITCH, FBGA-65

Jesd30 Code

S-PBGA-B65

Supply Voltagemax Vsup

3.1 V

Package Body Material

PLASTIC/EPOXY

Package Shape

SQUARE

Number Of Terminals

65

Terminal Adımı

0.8 mm

Memory Density

67108864 bit

Fonksiyon Sayısı

1

Package Style

GRID ARRAY, LOW PROFILE, FINE PITCH

Temperature Grade

OTHER

Memory Ic Type

MEMORY CIRCUIT

HTS Kodu

8542.32.00.71

Organization

4MX16

Terminal Pozisyonu

BOTTOM

Supply Currentmax

0.053 mA

Memory Width

16

Operating Temperaturemin

-30 °C

Package Code

LFBGA