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C3 ChipZentronix

Integrated Silicon Solution Inc

IS29GL032-70FLA3U

Memory Modules

RoHS: Compliant

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RoHS

Compliant

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Specifications

Seated Heightmax
1.4 mm
Data Retention Timemin
20
Package Equivalence Code
BGA64,8X8,40
Output Characteristics
3-STATE
Tip
NOR TYPE
Organization
2MX16
Supply Voltagemax Vsup
3.6 V
Memory Ic Type
FLASH
Operating Temperaturemax
125 °C
Operating Mode
ASYNCHRONOUS
Programming Voltage
3.3 V
REACH Uyumluluk Kodu
compliant
Yüzey Montaj
YES
Package Body Material
PLASTIC/EPOXY
Genişlik
11 mm
Package Code
LBGA
Page Size
8 words
Package Style
GRID ARRAY, LOW PROFILE
HTS Kodu
8542.32.00.51
Memory Density
33554432 bit
Fonksiyon Sayısı
1
Jesd30 Code
R-PBGA-B64
Parallelserial
PARALLEL
Ihs Manufacturer
INTEGRATED SILICON SOLUTION INC
Number Of Sectorssize
8,63
Rohs Code
Yes
Data Polling
YES
Package Shape
RECTANGULAR
Terminal Pozisyonu
BOTTOM
Sector Size
4K,32K
Write Cycle Timemax Twc
0.000075 ms
Supply Voltagenom Vsup
3.3 V
Date Of Intro
2018-11-19
Terminal Formu
BALL
ECCN Kodu
EAR99
Number Of Terminals
64
Part Life Cycle Code
Active
Uzunluk
13 mm
Endurance
100000 Write/Erase Cycles
Readybusy
YES

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