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Priced by quantity and lead time.
Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Supply Voltagenom Vsup
- 1.8 V
- Package Style
- GRID ARRAY, FINE PITCH
- Tepe Reflow Süresi (maks. sn)
- 30
- Package Description
- FBGA, BGA176,8X22,25
- Logic Ic Type
- BUS DRIVER
- Package Body Material
- PLASTIC/EPOXY
- Moisture Sensitivity Levels
- 3
- Yüzey Montaj
- YES
- Jesd30 Code
- R-PBGA-B176
- JESD-609 Kodu
- e1
- Package Code
- FBGA
- Operating Temperaturemax
- 70 °C
- Number Of Terminals
- 176
- Package Shape
- RECTANGULAR
- Terminal Kaplaması
- TIN SILVER COPPER
- HTS Kodu
- 8542.39.00.01
- Terminal Formu
- BALL
- Part Life Cycle Code
- Obsolete
- Terminal Adımı
- 0.635 mm
- Temperature Grade
- COMMERCIAL
- Ihs Manufacturer
- INTEGRATED DEVICE TECHNOLOGY INC
- Qualification Status
- Not Qualified
- Terminal Pozisyonu
- BOTTOM
- Package Equivalence Code
- BGA176,8X22,25
- REACH Uyumluluk Kodu
- unknown
- Tepe Reflow Sıcaklığı (°C)
- 260
- Rohs Code
- Yes
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