89TTM552BL

Specifications

Risk Rank

5.66

Part Life Cycle Code

Obsolete

Package Code

BGA

Package Style

GRID ARRAY

Supply Voltagemin

1.71 V

Jesd30 Code

S-PBGA-B960

Supply Voltagenom

1.8 V

Rohs Code

No

Ihs Manufacturer

INTEGRATED DEVICE TECHNOLOGY INC

Supply Voltagemax

1.89 V

Yüzey Montaj

YES

Part Package Code

BGA

Package Shape

SQUARE

Package Description

35 X 35 MM, 1 MM PITCH, FPBGA-960

Package Body Material

PLASTIC/EPOXY

Terminal Kaplaması

Tin/Lead (Sn/Pb)

HTS Kodu

8542.39.00.01

Temperature Grade

OTHER

Seated Heightmax

3.29 mm

Terminal Pozisyonu

BOTTOM

JESD-609 Kodu

e0

Reflow Temperaturemax S

30

Operating Temperaturemax

85 °C

Number Of Terminals

960

Upsucsperipheral Ics Type

MICROPROCESSOR CIRCUIT

Tepe Reflow Sıcaklığı (°C)

225

Pin Sayısı

960

REACH Uyumluluk Kodu

not_compliant

Üretici Parça No

89TTM552BL

ECCN Kodu

5A991

Genişlik

35 mm

Qualification Status

Not Qualified

Terminal Formu

BALL

Uzunluk

35 mm