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Priced by quantity and lead time.
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Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Ds Breakdown Voltagemin
- 200 V
- Typical Rise Time Ns
- 90(Max)
- Channel Mode
- Enhancement
- JESD-609 Kodu
- e0
- Reflow Temperaturemax S
- NOT SPECIFIED
- Configuration
- Single
- Terminal Kaplaması
- Tin/Lead (Sn/Pb)
- Number Of Elements Per Chip
- 1
- Transistor Element Material
- SILICON
- Yüzey Montaj
- YES
- Maximum Drain Source Voltage V
- 200
- Minimum Operating Temperature C
- -55
- Part Life Cycle Code
- Obsolete
- Process Technology
- HEXFET
- Drainsource On Resistancemax
- 0.8 Ω
- ECCN Kodu
- EAR99
- Qualification Status
- Not Qualified
- Pcb Changed
- 3
- Üretici Parça No
- IRHN9230
- Channel Type
- P
- Eccn Us
- Contact Export
- Number Of Elements
- 1
- Automotive
- No
- Polaritychannel Type
- P-CHANNEL
- Package Height
- 3.07(Max)
- Package Shape
- RECTANGULAR
- Category
- Power MOSFET
- Operating Temperaturemax
- 150 °C
- Package Length
- 11.55(Max)
- Operating Mode
- ENHANCEMENT MODE
- Supplier Package
- SMD-1
- Maximum Operating Temperature C
- 150
- Additional Feature
- RADIATION HARDENED
- Package Body Material
- CERAMIC, METAL-SEALED COFIRED
- Risk Rank
- 5.39
- Maximum Gate Source Voltage V
- ±20
- Maximum Gate Source Leakage Current Na
- 100
- Drain Currentmax Abs Id
- 35 A
- Maximum Gate Threshold Voltage V
- 4
- Parça Durumu
- Obsolete
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