IRF7456TRPBF-1

Specifications

Moisture Sensitivity Levels

1

Operating Temperaturemax

150 °C

Typical Input Capacitance Vds Pf

3640@15V

Reflow Temperaturemax S

NOT SPECIFIED

Number Of Elements Per Chip

1

Ambalaj

Tape and Reel

Maximum Power Dissipation Mw

2500

Maximum Idss Ua

20

Part Life Cycle Code

End Of Life

Rds On Max Id Vgs

6.5mOhm @ 16A, 10V

Input Capacitance Ciss Max Vds

3640 pF @ 15 V

Package Height

1.5(Max)

Maximum Operating Temperature C

150

Pcb Changed

8

Configuration

Single Quad Drain Triple Source

Channel Mode

Enhancement

Maximum Drain Source Resistance Mohm

6.5@10V

Typical Gate Charge Vgs Nc

41@5V

Paket

Tape & Reel (TR)

Power Dissipation Max

2.5W (Ta)

Ürün Durumu

Obsolete

Ppap

No

Vgs Max

±12V

Drain Currentmax Abs Id

16 A

Automotive

No

Standard Package Name

SOP

Çalışma Sıcaklığı

-55°C ~ 150°C (TJ)

Rohs Code

Yes

Typical Turnoff Delay Time Ns

50

Risk Rank

5.3

Eu Rohs

Compliant

Power Dissipationmax Abs

2.5 W

Package Length

5(Max)

Typical Rise Time Ns

25

Supplier Package

SOIC

Yüzey Montaj

YES

Maximum Gate Source Leakage Current Na

200

Vgsth Max Id

2V @ 250µA

Tepe Reflow Sıcaklığı (°C)

NOT SPECIFIED

Process Technology

HEXFET