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C3 ChipZentronix

Hifn Inc

8155PP5

Microprocessors

RoHS: Compliant

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Compliant

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Specifications

Ihs Manufacturer
HIFN
Package Description
BGA, BGA576,30X30,50
Qualification Status
Not Qualified
HTS Kodu
8542.31.00.01
Terminal Kaplaması
Tin/Lead (Sn/Pb)
Operating Temperaturemax
70 °C
Package Code
BGA
REACH Uyumluluk Kodu
unknown
Package Body Material
PLASTIC/EPOXY
Terminal Pozisyonu
BOTTOM
Jesd30 Code
S-PBGA-B576
Package Shape
SQUARE
Number Of Terminals
576
Part Life Cycle Code
Transferred
Package Style
GRID ARRAY
Rohs Code
No
JESD-609 Kodu
e0
Package Equivalence Code
BGA576,30X30,50
Yüzey Montaj
YES
Terminal Adımı
1.27 mm
Terminal Formu
BALL
Temperature Grade
COMMERCIAL

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