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Priced by quantity and lead time.
Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- JESD-609 Kodu
- e0
- Tepe Reflow Sıcaklığı (°C)
- NOT SPECIFIED
- Package Code
- BGA
- Risk Rank
- 5.13
- Fabrika Tedarik Süresi
- 8 Weeks
- Parallelserial
- PARALLEL
- Package Description
- BGA,
- Ambalaj
- Tray
- Üretici Parça No
- GS88236CB-200I
- Package Shape
- RECTANGULAR
- Operating Temperaturemin
- -40 °C
- Pin Sayısı
- 119
- Fonksiyon Sayısı
- 1
- Memory Size
- 9 Mbit
- Tip
- Pipeline/Flow Through
- Supply Voltagemax
- 3.6 V
- Operating Mode
- SYNCHRONOUS
- Operating Temperaturemax
- 85 °C
- Package Style
- GRID ARRAY
- Additional Feature
- PIPELINED/FLOW-THROUGH ARCHITECTURE, IT ALSO OPERATES WITH 3 V TO 3.6 V SUPPLY
- Minimum Operating Temperature
- - 40 C
- Terminal Formu
- BALL
- Access Timemax
- 6.5 ns
- Kurşunsuz Kodu
- No
- Maximum Clock Frequency
- 200 MHz
- Ürün Tipi
- SRAM
- Supply Voltagemax Vsup
- 2.7 V
- Access Time
- 6.5 ns
- Temperature Grade
- INDUSTRIAL
- Rohs Code
- No
- Maks. Çalışma Sıcaklığı
- + 85 C
- Yüzey Montaj
- YES
- Technology
- CMOS
- Supply Currentmax
- 160 mA, 190 mA
- REACH Uyumluluk Kodu
- compliant
- Number Of Words
- 262144 words
- Moisture Sensitive
- Yes
- Package Body Material
- PLASTIC/EPOXY
- Number Of Words Code
- 256000
- Memory Density
- 9437184 bit
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