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Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Package Description
- LBGA, BGA165,11X15,40
- Density
- 36 Mbit
- Ambalaj
- Tray
- Clock Frequencymax Fclk
- 300 MHz
- Çalışma Sıcaklığı
- -40 to 100 °C
- Üretici Parça No
- GS8342TT07BD-300I
- Package Shape
- RECTANGULAR
- Operating Temperaturemin
- -40 °C
- Pin Sayısı
- 165
- Memory Size
- 36 Mbit
- Fonksiyon Sayısı
- 1
- JESD-609 Kodu
- e0
- Data Rate Architecture
- DDR
- Tepe Reflow Sıcaklığı (°C)
- NOT SPECIFIED
- Risk Rank
- 5.36
- Package Code
- LBGA
- Package Equivalence Code
- BGA165,11X15,40
- Fabrika Tedarik Süresi
- 10 Weeks
- Parallelserial
- PARALLEL
- Additional Feature
- PIPELINED ARCHITECTURE, LATE WRITE
- Minimum Operating Temperature
- - 40 C
- Address Bus Width
- 21 Bit
- Io Type
- COMMON
- Terminal Formu
- BALL
- Access Timemax
- 0.45 ns
- Timing Type
- Synchronous
- Maximum Clock Frequency
- 300 MHz
- Ürün Tipi
- SRAM
- Power Supplies
- 1.5/1.8,1.8 V
- Tip
- SigmaDDR-II+ B2
- Supply Voltagemax
- 1.9 V
- Operating Temperaturemax
- 85 °C
- Operating Mode
- SYNCHRONOUS
- Screening Level
- Industrial
- Package Style
- GRID ARRAY, LOW PROFILE
- Moisture Sensitive
- Yes
- Supplier Package
- FBGA
- Package Body Material
- PLASTIC/EPOXY
- Number Of Ports
- 1
- Memory Density
- 33554432 bit
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