GS8182T37BGD-300

Specifications

Parallelserial

PARALLEL

Package Equivalence Code

BGA165,11X15,40

Fabrika Tedarik Süresi

8 Weeks

Risk Rank

5.2

Package Code

LBGA

Tepe Reflow Sıcaklığı (°C)

260

JESD-609 Kodu

e1

Fonksiyon Sayısı

1

Pin Sayısı

165

Package Shape

RECTANGULAR

Üretici Parça No

GS8182T37BGD-300

Clock Frequencymax Fclk

300 MHz

Package Description

LBGA, BGA165,11X15,40

Package Style

GRID ARRAY, LOW PROFILE

Standby Currentmax

0.155 A

Operating Temperaturemax

70 °C

Operating Mode

SYNCHRONOUS

Power Supplies

1.5/1.8,1.8 V

Kurşunsuz Kodu

Yes

Access Timemax

0.45 ns

Terminal Formu

BALL

Io Type

COMMON

Additional Feature

PIPELINED ARCHITECTURE

Number Of Words

524288 words

REACH Uyumluluk Kodu

compliant

Standby Voltagemin

1.7 V

Supply Currentmax

0.455 mA

Yüzey Montaj

YES

Technology

CMOS

Rohs Code

Yes

Supply Voltagemax Vsup

1.9 V

Temperature Grade

COMMERCIAL

Supply Voltagenom Vsup

1.8 V

Supply Voltagemin Vsup

1.7 V

Part Package Code

BGA

Uzunluk

15 mm

Memory Density

18874368 bit

Number Of Words Code

512000

Qualification Status

Not Qualified

Package Body Material

PLASTIC/EPOXY