GS8162Z18DGB-400

Specifications

Çalışma Sıcaklığı

0 to 85 °C

Ambalaj

Tray

Density

18 Mbit

Package Description

BGA,

Memory Size

18 Mbit

Fonksiyon Sayısı

1

Pin Sayısı

119

Package Shape

RECTANGULAR

Üretici Parça No

GS8162Z18DGB-400

Risk Rank

5.27

Package Code

BGA

Tepe Reflow Sıcaklığı (°C)

NOT SPECIFIED

Data Rate Architecture

SDR

Parallelserial

PARALLEL

Fabrika Tedarik Süresi

10 Weeks

Minimum Operating Temperature

0 C

Address Bus Width

20 Bit

Additional Feature

FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY

Ürün Tipi

SRAM

Timing Type

Synchronous

Maximum Clock Frequency

400 MHz

Access Timemax

4 ns

Terminal Formu

BALL

Tip

NBT Pipeline/Flow Through

Supply Voltagemax

3.6 V

Screening Level

Commercial

Package Style

GRID ARRAY

Operating Temperaturemax

85 °C

Operating Mode

SYNCHRONOUS

Qualification Status

Not Qualified

Number Of Words Code

1000000

Memory Density

18874368 bit

Number Of Ports

2

Package Body Material

PLASTIC/EPOXY

Moisture Sensitive

Yes

Supplier Package

FBGA

Supply Voltagenom Vsup

2.5 V

Supply Voltagemin Vsup

2.3 V

Interface Type

Parallel

Part Package Code

BGA