GS8162Z18DGB-250I

Specifications

Fabrika Tedarik Süresi

10 Weeks

Parallelserial

PARALLEL

Tepe Reflow Sıcaklığı (°C)

NOT SPECIFIED

Package Code

BGA

Risk Rank

5.26

Package Shape

RECTANGULAR

Üretici Parça No

GS8162Z18DGB-250I

Fonksiyon Sayısı

1

Memory Size

18 Mbit

Operating Temperaturemin

-40 °C

Pin Sayısı

119

Package Description

BGA,

Ambalaj

Tray

Operating Mode

SYNCHRONOUS

Operating Temperaturemax

85 °C

Package Style

GRID ARRAY

Tip

NBT Pipeline/Flow Through

Supply Voltagemax

3.6 V

Access Timemax

5.5 ns

Terminal Formu

BALL

Ürün Tipi

SRAM

Maximum Clock Frequency

250 MHz

Additional Feature

FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY

Minimum Operating Temperature

- 40 C

Supply Currentmax

230 mA, 250 mA

Number Of Words

1048576 words

REACH Uyumluluk Kodu

compliant

Maks. Çalışma Sıcaklığı

+ 85 C

Supply Voltagemax Vsup

2.7 V

Access Time

5.5 ns

Temperature Grade

INDUSTRIAL

Rohs Code

Yes

Yüzey Montaj

YES

Technology

CMOS

Part Package Code

BGA

Uzunluk

22 mm

Supply Voltagemin Vsup

2.3 V

Supply Voltagenom Vsup

2.5 V

Interface Type

Parallel

Moisture Sensitive

Yes