MB89R118C2-DIAP15-P1

Specifications

Operating Temperaturemax

85 °C

Package Code

DIE

HTS Kodu

8542.39.00.01

Memory Density

16384 bit

Terminal Formu

NO LEAD

Package Shape

UNSPECIFIED

Package Body Material

UNSPECIFIED

Memory Ic Type

FRAM-EMBEDDED

Package Description

DIE,

Package Style

UNCASED CHIP

Organization

2KX8

Fonksiyon Sayısı

1

Yüzey Montaj

YES

Jesd30 Code

X-XUUC-N

Endurance

1000000000000 Write/Erase Cycles

REACH Uyumluluk Kodu

unknown

Package Equivalence Code

DIE OR CHIP

Data Retention Timemin

10

Terminal Pozisyonu

UPPER

Number Of Words Code

2000

Memory Width

8

Operating Temperaturemin

-20 °C

Part Life Cycle Code

Active

Number Of Words

2048 words

Ihs Manufacturer

FUJITSU LTD

Additional Feature

DATA RETENTION TIME @ 85 DEGREE CENTIGRADE