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C3 ChipZentronix

FTDI

DLP-FPGA

Embedded ICs Modules

RoHS: Compliant

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Priced by quantity and lead time.

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RoHS

Compliant

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Specifications

Fabrika Paket Adedi
1
RoHS
Details
Ürün Tipi
Interface Development Tools
Renk
Clear
Shrink Ratio
2:1
Product Length Mm
1200(mm)
Ürün Durumu
Active
Tip
TUBING
Moduleboard Type
FPGA Core
Paket
Bulk
Shrink Wall Type
SINGLE
Seri
FPGA
Inside Diameter Before Shrinking
6.4
Operating Temp Range
-55C to 135C
Connector Type
USB - B, Pin Header
Body Material
Polyolefin
Core Processor
Spartan-3E, XC3S250E
Ambalaj
Bulk
Product Thickness
0.64
Inside Diameter After Shrinking
3.2
Ram Size
128KB

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