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C3 ChipZentronix

Freescale Semiconductor, Inc. (NXP Semiconductors)

XPC860ENZP50D4

Microprocessors

RoHS: Compliant

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Compliant

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Specifications

Terminal Pozisyonu
BOTTOM
Low Power Mode
YES
Usb
0
Package Equivalence Code
BGA357,19X19,50
Ethernet
0
Package Height
1.35(Max)
Parça Durumu
Obsolete
Minimum Operating Temperature C
0
Spi
1
Eccn Us
5A991
Svhc Exceeds Threshold
Yes
Üretici Parça No
XPC860ENZP50D4
Pin Sayısı
357
Integrated Cache
YES
Ihs Manufacturer
MOTOROLA INC
Yüzey Montaj
YES
Package Description
BGA, BGA357,19X19,50
REACH Uyumluluk Kodu
unknown
Interface Type
I2C/SPI/UART
Standard Package Name
BGA
Uart
1
ECCN Kodu
3A001.A.3
Mounting
Surface Mount
I2c
1
Supply Voltagemin
3.135 V
Onchip Memory
8KB/RAM
Format
FIXED POINT
Data Bus Width Bit
32
Terminal Adımı
1.27 mm
Jesd30 Code
S-PBGA-B357
Typical Operating Supply Voltage V
2.5|3.3
Device Core
MPC8xx
Package Shape
SQUARE
Risk Rank
5.1
Ppap
No
Part Life Cycle Code
Transferred
Supply Voltagemax
3.465 V
Instruction Cache Size
4KB
Pcb Changed
357
Package Code
BGA

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