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C3 ChipZentronix

Freescale Semiconductor, Inc. (NXP Semiconductors)

XPC850DSLZT50BU

Microprocessors

RoHS: Compliant

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RoHS

Compliant

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Specifications

Yüzey Montaj
YES
Tepe Reflow Sıcaklığı (°C)
220
Terminal Sayısı
256
Integrated Cache
YES
Upsucsperipheral Ics Type
MICROPROCESSOR, RISC
Terminal Formu
BALL
Nem Hassasiyeti (MSL)
3 (168 Hours)
Kurşunsuz
Contains Lead
Low Power Mode
YES
Terminal Pozisyonu
BOTTOM
Frekans
50MHz
Tepe Reflow Süresi (maks. sn)
30
Boundary Scan
YES
Halogen Free
Not Halogen Free
Pin Sayısı
256
JESD-609 Kodu
e0
Number Of Cores
1
Bit Size
32
Maks. Oturma Yüksekliği
2.35mm
Address Bus Width
26
Genişlik
23mm
Power Supplies
3.3V
Terminal Kaplaması
TIN LEAD
External Data Bus Width
32
Supply Voltagemax Vsup
3.465V
RoHS Durumu
RoHS Compliant
Uzunluk
23mm
Besleme Gerilimi
3.3V
Format
FIXED POINT
Min. Çalışma Sıcaklığı
0°C
Qualification Status
Not Qualified
Maks. Çalışma Sıcaklığı
95°C
Kılıf / Paket
BGA

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