PSMN059-150Y,115

Specifications

Lead Shape

Gull-wing

Typical Rise Time Ns

42

Maximum Power Dissipation Mw

113000

Typical Gate To Drain Charge Nc

9.1

Typical Gate To Source Charge Nc

6.3

Channel Type

N

Maximum Drain Source Resistance Mohm

59@10V

Number Of Elements Per Chip

1

Mounting

Surface Mount

Operating Junction Temperature C

-55 to 150

Typical Diode Forward Voltage V

0.9

Maximum Operating Temperature C

150

Package Height

1.1(Max)

Typical Turnon Delay Time Ns

14.2

Typical Reverse Recovery Time Ns

67

Package Width

4.1(Max)

Typical Fall Time Ns

11.1

Typical Input Capacitance Vds Pf

1529@30V

Maximum Idss Ua

1

Typical Gate Plateau Voltage V

4.8

Parça Durumu

Active

Svhc Exceeds Threshold

Yes

Eccn Us

EAR99

Maximum Gate Source Voltage V

±20

Standard Package Name

FPAK

Configuration

Single Triple Source

Typical Reverse Transfer Capacitance Vds Pf

66@30V

Channel Mode

Enhancement

Pin Sayısı

5

Automotive

No

Maximum Continuous Drain Current A

43

Ambalaj

Tape and Reel

Pcb Changed

4

Typical Gate Charge10v Nc

27.9

Minimum Gate Threshold Voltage V

2

Typical Gate Charge Vgs Nc

27.9@10V

Maximum Pulsed Drain Current Tc25c A

129

Maximum Diode Forward Voltage V

1.2

Supplier Package

LFPAK

Svhc

Yes