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Priced by quantity and lead time.
Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Terminal Formu
- BALL
- Package Description
- BGA,
- Package Style
- GRID ARRAY
- REACH Uyumluluk Kodu
- unknown
- Speed
- 300 MHz
- Package Body Material
- CERAMIC, METAL-SEALED COFIRED
- Ihs Manufacturer
- FREESCALE SEMICONDUCTOR INC
- Yüzey Montaj
- YES
- Integrated Cache
- NO
- Seated Heightmax
- 3.2 mm
- Upsucsperipheral Ics Type
- MICROPROCESSOR, RISC
- Pin Sayısı
- 360
- Bit Size
- 32
- Terminal Pozisyonu
- BOTTOM
- Number Of Terminals
- 360
- Low Power Mode
- YES
- Boundary Scan
- NO
- Supply Voltagenom
- 1.9 V
- Uzunluk
- 25 mm
- Part Package Code
- BGA
- Clock Frequencymax
- 100 MHz
- Genişlik
- 25 mm
- HTS Kodu
- 8542.31.00.01
- Package Code
- BGA
- Supply Voltagemax
- 2 V
- Part Life Cycle Code
- Transferred
- Additional Feature
- ALSO REQUIRES 3.3V SUPPLY
- Package Shape
- SQUARE
- Terminal Adımı
- 1.27 mm
- Format
- FIXED POINT
- Supply Voltagemin
- 1.8 V
- Jesd30 Code
- S-CBGA-B360
- Qualification Status
- Not Qualified
- ECCN Kodu
- 3A991.A.2