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Priced by quantity and lead time.
Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Operating Temperaturemax
- 125 °C
- Max Iol
- 0.004 A
- Power Supply Currentmax Icc
- 6 mA
- Ihs Manufacturer
- MOTOROLA SEMICONDUCTOR PRODUCTS
- Wall Thickness After Shrinkage
- 0.7 mm
- Operating Temperaturemin
- -55 °C
- Package Equivalence Code
- DIP16,.3
- Supply Voltagenom Vsup
- 5 V
- Trigger Type
- NEGATIVE EDGE
- Operating Temperature Range
- -55…+125 °C
- Shrink Temperature
- +70…+120 °C
- Shrink Ratio
- 2 : 1
- Diameter Before Shrinkage
- 17.0 mm
- Logic Ic Type
- J-K FLIP-FLOP
- Wall Thickness Before Shrinkage
- 0.4 mm
- Power Supplies
- 5 V
- Terminal Adımı
- 2.54 mm
- Renk
- yellow
- Temperature Grade
- MILITARY
- Yüzey Montaj
- NO
- Operating Voltage
- 600 V
- Fonksiyon Sayısı
- 2
- Terminal Pozisyonu
- DUAL
- Ambalaj
- in packs of 1m lengths
- JESD-609 Kodu
- e0
- REACH Uyumluluk Kodu
- unknown
- Rohs Code
- No
- Jesd30 Code
- R-XDIP-T16
- Package Style
- IN-LINE
- Tip
- Non-adhesive heat shrink tube
- Package Description
- DIP, DIP16,.3
- Diameter After Shrinkage
- 8.0 mm
- Number Of Terminals
- 16
- Terminal Formu
- THROUGH-HOLE
- Part Life Cycle Code
- Obsolete
- Terminal Kaplaması
- Tin/Lead (Sn/Pb)
- Max Frequencynomsup
- 30000000 Hz
- Transport Packaging Sizequantity
- 102*20*20/500
- Package Code
- DIP
- Package Body Material
- CERAMIC