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Priced by quantity and lead time.
Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Package Style
- GRID ARRAY
- JESD-609 Kodu
- e0
- Terminal Pozisyonu
- BOTTOM
- REACH Uyumluluk Kodu
- not_compliant
- Rohs Code
- No
- Jesd30 Code
- S-PBGA-B783
- Terminal Formu
- BALL
- Part Life Cycle Code
- Obsolete
- Terminal Kaplaması
- TIN LEAD SILVER
- Moisture Sensitivity Levels
- 3
- Package Description
- BGA, BGA783,28X28,40
- Number Of Terminals
- 783
- Tepe Reflow Süresi (maks. sn)
- 30
- Package Code
- BGA
- Package Shape
- SQUARE
- Package Body Material
- PLASTIC/EPOXY
- Qualification Status
- Not Qualified
- Speed
- 333 MHz
- Package Equivalence Code
- BGA783,28X28,40
- Ihs Manufacturer
- FREESCALE SEMICONDUCTOR INC
- Tepe Reflow Sıcaklığı (°C)
- 245
- HTS Kodu
- 8542.31.00.01
- Terminal Adımı
- 1 mm
- Bit Size
- 32
- Upsucsperipheral Ics Type
- MICROPROCESSOR, RISC
- Yüzey Montaj
- YES