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Priced by quantity and lead time.
Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Part Package Code
- BGA
- Operating Temperaturemax
- 105 °C
- Qualification Status
- Not Qualified
- Terminal Kaplaması
- Tin/Silver (Sn/Ag)
- Package Shape
- SQUARE
- Yüzey Montaj
- YES
- Package Style
- GRID ARRAY
- Tepe Reflow Sıcaklığı (°C)
- 260
- Package Description
- 29 X 29 MM, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-783
- HTS Kodu
- 8542.31.00.01
- Uzunluk
- 29 mm
- ECCN Kodu
- 5A002
- Package Code
- BGA
- Pin Sayısı
- 783
- Supply Voltagemin
- 1.045 V
- Jesd30 Code
- S-PBGA-B783
- Temperature Grade
- OTHER
- Upsucsperipheral Ics Type
- SoC
- Rohs Code
- Yes
- Ihs Manufacturer
- FREESCALE SEMICONDUCTOR INC
- Supply Voltagemax
- 1.155 V
- Package Equivalence Code
- BGA783,28X28,40
- Terminal Formu
- BALL
- REACH Uyumluluk Kodu
- not_compliant
- Number Of Terminals
- 783
- Part Life Cycle Code
- Obsolete
- Tepe Reflow Süresi (maks. sn)
- 40
- Genişlik
- 29 mm
- Supply Voltagenom
- 1.1 V
- Terminal Pozisyonu
- BOTTOM
- Seated Heightmax
- 3.38 mm
- JESD-609 Kodu
- e2
- Operating Temperaturemin
- -40 °C
- Terminal Adımı
- 1 mm
- Moisture Sensitivity Levels
- 3
- Package Body Material
- PLASTIC/EPOXY