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Priced by quantity and lead time.
Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Package Body Material
- CERAMIC, METAL-SEALED COFIRED
- Moisture Sensitivity Levels
- 1
- JESD-609 Kodu
- e0
- Low Power Mode
- YES
- Terminal Adımı
- 1.27 mm
- Terminal Formu
- BALL
- Package Equivalence Code
- BGA360,19X19,50
- Integrated Cache
- YES
- REACH Uyumluluk Kodu
- not_compliant
- Number Of Terminals
- 360
- Part Life Cycle Code
- Obsolete
- Genişlik
- 25 mm
- Tepe Reflow Süresi (maks. sn)
- 30
- Supply Voltagenom
- 1.3 V
- Terminal Pozisyonu
- BOTTOM
- Seated Heightmax
- 3.2 mm
- Ihs Manufacturer
- FREESCALE SEMICONDUCTOR INC
- Rohs Code
- No
- Boundary Scan
- YES
- Supply Voltagemax
- 1.35 V
- Bit Size
- 32
- Speed
- 1267 MHz
- Address Bus Width
- 36
- Supply Voltagemin
- 1.25 V
- Format
- FLOATING POINT
- Jesd30 Code
- S-CBGA-B360
- Upsucsperipheral Ics Type
- MICROPROCESSOR, RISC
- Clock Frequencymax
- 167 MHz
- Package Code
- BGA
- Pin Sayısı
- 360
- Tepe Reflow Sıcaklığı (°C)
- 220
- Package Style
- GRID ARRAY
- Package Description
- 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360
- External Data Bus Width
- 64
- HTS Kodu
- 8542.31.00.01
- ECCN Kodu
- 3A991.A.2
- Uzunluk
- 25 mm
- Part Package Code
- BGA
- Qualification Status
- Not Qualified
- Terminal Kaplaması
- Tin/Lead (Sn/Pb)