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C3 ChipZentronix

Freescale

MCIMX513DJM8C

Microprocessors

RoHS: Compliant

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Compliant

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Specifications

Pozisyon Sayısı
79
Ram Controllers
LPDDR, DDR2
Contact Finish Thickness Mating
50.0µin (1.27µm)
Display Interface Controllers
Keypad, LCD
Shell Material
Composite
Renk
Silver
Orientation
N (Normal)
Shell Size Insert
21-35
Contact Materials
Copper Alloy
Ürün Durumu
Active
Additional Interfaces
1-Wire, AC97, I²C, I²S, MMC/SD, SPI, SSI, UART
Voltage Io
1.2V, 1.875V, 2.775V, 3.0V
Usb
USB 2.0 (3), USB 2.0 + PHY (1)
Shell Finish
Nickel
Security Features
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Ethernet
10/100Mbps (1)
Kılıf / Paket
529-LFBGA
Çalışma Sıcaklığı
-65°C ~ 200°C
Primary Material
Composite
Number Of Coresbus Width
1 Core, 32-Bit
Speed
800MHz
Seri
BACC63
Paket
Bulk
Temel Ürün No
BACC63CU21
Core Processor
ARM® Cortex®-A8
Fastening Type
Threaded
Mounting Feature
Flange
Montaj Tipi
Panel Mount
Connector Type
Receptacle, Male Pins
Coprocessorsdsp
Multimedia; NEON™ SIMD
Tedarikçi Cihaz Paketi
529-BGA (19x19)
Terminal
Crimp
Contact Finish Mating
Gold
Graphics Acceleration
No

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