EN25QA64A-104BBIP

Specifications

Package Equivalence Code

BGA24,4X6,40

Tepe Reflow Sıcaklığı (°C)

NOT SPECIFIED

Ihs Manufacturer

ELITE SEMICONDUCTOR MEMORY TECHNOLOGY INC

Part Life Cycle Code

Active

Genişlik

6 mm

Tepe Reflow Süresi (maks. sn)

NOT SPECIFIED

Fonksiyon Sayısı

1

Package Shape

RECTANGULAR

Package Description

TBGA,

Memory Density

67108864 bit

Programming Voltage

3 V

Operating Mode

SYNCHRONOUS

Number Of Words Code

8000000

REACH Uyumluluk Kodu

unknown

Data Retention Timemin

20

Standby Currentmax

0.00002 A

HTS Kodu

8542.32.00.51

Memory Ic Type

FLASH

Clock Frequencymax Fclk

104 MHz

Rohs Code

Yes

Alternate Memory Width

1

Operating Temperaturemax

85 °C

Terminal Formu

BALL

Serial Bus Type

SPI

Uzunluk

8 mm

Supply Voltagemin Vsup

2.7 V

Package Style

GRID ARRAY, THIN PROFILE

Package Body Material

PLASTIC/EPOXY

ECCN Kodu

EAR99

Number Of Words

8388608 words

Yüzey Montaj

YES

Package Code

TBGA

Output Characteristics

3-STATE

Terminal Pozisyonu

BOTTOM

Parallelserial

SERIAL

Supply Currentmax

0.035 mA

Supply Voltagenom Vsup

3 V

Write Protection

SOFTWARE

Number Of Terminals

24

Memory Width

8