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C3 ChipZentronix

Cypress Semiconductor

S29GL064A10FAIR30

Memory Modules

RoHS: Compliant

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Compliant

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Specifications

Type Of Wire
data transmission
Seated Heightmax
1.4 mm
Package Code
LBGA
Terminal Formu
BALL
Wire Insulation Material
PVC
Kurşunsuz Kodu
No
Gross Weight
2525.8 g
Package Body Material
PLASTIC/EPOXY
Toggle Bit
YES
Core Structure
stranded
Core Diameter
28AWG
Data Polling
YES
Number Of Words Code
4000000
Genişlik
11 mm
Jesd30 Code
R-PBGA-B64
Number Of Sectorssize
8,127
Rated Voltage
50V
Access Timemax
100 ns
Number Of Cores
24
Number Of Terminals
64
Package Description
13 X 11 MM, FBGA-64
Organization
4MX16
Operating Temperaturemin
-40 °C
Package Equivalence Code
BGA64,8X8,40
Qualification Status
Not Qualified
Uzunluk
13 mm
Readybusy
YES
Terminal Kaplaması
TIN LEAD
Package Shape
RECTANGULAR
Supply Voltagemin Vsup
3 V
Earth Core
none
Parallelserial
PARALLEL
Part Package Code
BGA
Package Contents
30.5m
Saturation Current
3
Fonksiyon Sayısı
1
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
Command User Interface
YES
Terminal Adımı
1 mm
Standby Currentmax
0.000005 A

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