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C3 ChipZentronix
HSB37-404023

CUI Devices

HSB37-404023

Heat Sinks

In StockRoHS: Compliant

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Same-day dispatch from stock

Genuine parts

Verified sourcing

RoHS

Compliant

Support

Technical team support

Specifications

Type Of Heatsink
extruded
Thermal Resistance200 Lfm
2.1°C/W
Plate Thickness
3.5mm
Colour
black
Material Finish
Black Anodized
Shape
Square, Pin Fins
Seri
HSB
Material Finishing
anodized
Gross Weight
21.88 g
Ambalaj
Box
Material
Aluminum Alloy
Uzunluk
1.575" (40.00mm)
Genişlik
1.575" (40.00mm)
Thermal Resistance
max. 7.8°C/W
Yükseklik
23mm
Fin Height
0.905" (23.00mm)
Tip
Top Mount
Mounting
for back plate
Thermal Resistance Natural
6.43°C/W
Parça Durumu
Active
Thermal Resistance Forced Air Flow
2.10°C/W @ 200 LFM
Power Dissipation Temperature Rise
11.7W @ 75°C
Attachment Method
Adhesive (Not Included)
Heatsink Shape
grilled
Package Cooled
BGA

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