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C3 ChipZentronix

CUI Devices

HSB32-232318

Heat Sinks

RoHS: Compliant

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RoHS

Compliant

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Specifications

Mounting
for back plate
Type Of Heatsink
extruded
Yükseklik
18mm
Thermal Resistance200 Lfm
4.4°C/W
Plate Thickness
1.5mm
Colour
black
Material
aluminium
Uzunluk
23mm
Thermal Resistance
max. 17.2°C/W
Genişlik
23mm
Heatsink Shape
grilled
Material Finishing
anodized
Gross Weight
14.2 g

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