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C3 ChipZentronix

CUI Devices

HSB27-434316

Heat Sinks

In StockRoHS: Compliant
Volume pricing
  • 1+ pcs$2.31
  • 10+ pcs$2.18
  • 100+ pcs$2.06
  • 500+ pcs$1.94

Shipping

Same-day dispatch from stock

Genuine parts

Verified sourcing

RoHS

Compliant

Support

Technical team support

Specifications

Shape
Square, Pin Fins
Montaj Stili
Adhesive
Material Finish
Black Anodized
Renk
Black
Thermal Resistance Natural
8.35°C/W
RoHS
Details
Tip
BGA Heatsink
Ürün Durumu
Active
Yükseklik
16.51 mm
Fin Style
Vertical Fin
Package Cooled
BGA
Thermal Resistance
9.6 C/W
Genişlik
43.1 mm
Uzunluk
43.1 mm
Paket
Box
Material
Aluminum Alloy
Attachment Method
Adhesive
Designed For
BGA
Heatsink Material
Aluminum
Power Dissipation Temperature Rise
8.98W @ 75°C
Thermal Resistance Forced Air Flow
2.80°C/W @ 200 LFM
Seri
HSB

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