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C3 ChipZentronix

CUI Devices

HSB22-606010

Heat Sinks

In StockRoHS: Compliant
Volume pricing
  • 1+ pcs$3.00
  • 10+ pcs$2.83
  • 100+ pcs$2.67
  • 500+ pcs$2.52

Shipping

Same-day dispatch from stock

Genuine parts

Verified sourcing

RoHS

Compliant

Support

Technical team support

Specifications

Base Thickness
3mm
Thermal Resistance Natural
7.62°C/W
Mounting
for back plate
Tip
Top Mount
Yükseklik
10 mm
Fin Style
Vertical Fin
Heatsink Shape
grilled
Package Cooled
BGA
Designed For
BGA
Attachment Method
Adhesive
Power Dissipation Temperature Rise
9.8W @ 75°C
Thermal Resistance Forced Air Flow
2.60°C/W @ 200 LFM
Shape
Square, Pin Fins
Montaj Stili
Adhesive
Material Finish
Black Anodized
Colour
black
Ürün Durumu
Active
Thermal Resistance200 Lfm
2.6°C/W
Type Of Heatsink
extruded
Thermal Resistance
10.1 C/W
Genişlik
2.362 (60.00mm)
Uzunluk
2.362 (60.00mm)
Material
Aluminum
Paket
Box
Heatsink Material
Aluminum Alloy
Gross Weight
80g
Certificates
RoHS compliant
Material Finishing
anodized
Seri
HSB

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