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C3 ChipZentronix

CUI Devices

HSB13-303014

Heat Sinks

In StockRoHS: Compliant
Volume pricing
  • 1+ pcs$1.14
  • 10+ pcs$1.08
  • 100+ pcs$1.02
  • 500+ pcs$0.96

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Same-day dispatch from stock

Genuine parts

Verified sourcing

RoHS

Compliant

Support

Technical team support

Specifications

Thermal Resistance
14.8 C/W
Genişlik
30.7 mm
Package Cooled
BGA
Paket
Box
Material
Aluminum Alloy
Attachment Method
Adhesive
Designed For
BGA
Uzunluk
30.7 mm
Power Dissipation Temperature Rise
6.1W @ 75°C
Thermal Resistance Forced Air Flow
4.70°C/W @ 200 LFM
Heatsink Material
Aluminum Alloy
Seri
HSB
Material Finish
Black Anodized
Renk
Black
Shape
Square, Pin Fins
Montaj Stili
Adhesive
Tip
Top Mount
Fabrika Paket Adedi
1440
Thermal Resistance Natural
12.36°C/W
Ürün Durumu
Active
Yükseklik
14.1 mm
Fin Style
Vertical Fin

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