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C3 ChipZentronix

CUI Devices

HSB12-272706

Heat Sinks

In StockRoHS: Compliant
Volume pricing
  • 1+ pcs$0.73
  • 10+ pcs$0.69
  • 100+ pcs$0.65
  • 500+ pcs$0.61

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Same-day dispatch from stock

Genuine parts

Verified sourcing

RoHS

Compliant

Support

Technical team support

Specifications

Heatsink Material
Aluminum Alloy
Gross Weight
4.55g
Certificates
RoHS compliant
Material Finishing
anodized
Seri
HSB
Thermal Resistance
22.5 C/W
Genişlik
27 mm
Uzunluk
27 mm
Paket
Box
Material
Aluminum Alloy
Colour
black
Ürün Durumu
Active
Thermal Resistance200 Lfm
7.8°C/W
Type Of Heatsink
extruded
Montaj Stili
Adhesive
Shape
Square, Pin Fins
Material Finish
Black Anodized
Fabrika Paket Adedi
1540
Power Dissipation Temperature Rise
3.8W @ 75°C
Thermal Resistance Forced Air Flow
7.80°C/W @ 200 LFM
Package Cooled
BGA
Heatsink Shape
grilled
Attachment Method
Adhesive
Designed For
BGA
Yükseklik
6 mm
Fin Style
Vertical Fin
Base Thickness
1.52mm
Renk
Black
Thermal Resistance Natural
19.59°C/W
Mounting
for back plate
Tip
Top Mount

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