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C3 ChipZentronix

CUI Devices

HSB07-202009

Heat Sinks

RoHS: Compliant

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RoHS

Compliant

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Specifications

Package Cooled
BGA
Thermal Resistance
29.2 C/W
Genişlik
20 mm
Uzunluk
20 mm
Paket
Box
Material
Aluminum Alloy
Attachment Method
Adhesive
Designed For
BGA
Heatsink Material
Aluminum Alloy
Power Dissipation Temperature Rise
3.1W @ 75°C
Thermal Resistance Forced Air Flow
8.60°C/W @ 200 LFM
Seri
HSB
Shape
Square, Pin Fins
Montaj Stili
Adhesive
Renk
Black
Material Finish
Black Anodized
Thermal Resistance Natural
24.08°C/W
Fabrika Paket Adedi
1872
Tip
Top Mount
Ürün Durumu
Active
Yükseklik
9 mm
Fin Style
Vertical Fin

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