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C3 ChipZentronix

CUI Devices

HSB03-141406

Heat Sinks

In StockRoHS: Compliant
Volume pricing
  • 1+ pcs$0.62
  • 10+ pcs$0.58
  • 100+ pcs$0.55
  • 500+ pcs$0.52

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Same-day dispatch from stock

Genuine parts

Verified sourcing

RoHS

Compliant

Support

Technical team support

Specifications

Gross Weight
1.63g
Heatsink Material
Aluminum Alloy
Material Finishing
anodized
Seri
HSB
Certificates
RoHS compliant
Thermal Resistance
39.7 C/W
Genişlik
14 mm
Paket
Box
Material
Aluminum Alloy
Uzunluk
14 mm
Ürün Durumu
Active
Thermal Resistance200 Lfm
15.8°C/W
Colour
black
Type Of Heatsink
extruded
Material Finish
Black Anodized
Montaj Stili
Adhesive
Shape
Square, Pin Fins
Fabrika Paket Adedi
3672
Power Dissipation Temperature Rise
2.1W @ 75°C
Thermal Resistance Forced Air Flow
15.80°C/W @ 200 LFM
Heatsink Shape
grilled
Package Cooled
BGA
Designed For
BGA
Attachment Method
Adhesive
Yükseklik
6 mm
Fin Style
Vertical Fin
Renk
Black
Base Thickness
1.5mm
Tip
Top Mount
Thermal Resistance Natural
35.98°C/W
Mounting
for back plate

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