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C3 ChipZentronix

CUI Devices

HSB03-121218

Heat Sinks

In StockRoHS: Compliant
Volume pricing
  • 1+ pcs$0.75
  • 10+ pcs$0.70
  • 100+ pcs$0.66
  • 500+ pcs$0.63

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Same-day dispatch from stock

Genuine parts

Verified sourcing

RoHS

Compliant

Support

Technical team support

Specifications

Genişlik
12 mm
Thermal Resistance
28.8 C/W
Paket
Box
Material
Aluminum Alloy
Uzunluk
12 mm
Gross Weight
3.81g
Heatsink Material
Aluminum Alloy
Seri
HSB
Material Finishing
anodized
Certificates
RoHS compliant
Material Finish
Black Anodized
Shape
Square, Pin Fins
Montaj Stili
Adhesive
Fabrika Paket Adedi
2520
Thermal Resistance200 Lfm
9.6°C/W
Ürün Durumu
Active
Colour
black
Type Of Heatsink
extruded
Package Cooled
BGA
Heatsink Shape
grilled
Designed For
BGA
Attachment Method
Adhesive
Thermal Resistance Forced Air Flow
9.60°C/W @ 200 LFM
Power Dissipation Temperature Rise
3.1W @ 75°C
Renk
Black
Base Thickness
3.6mm
Tip
Top Mount
Mounting
for back plate
Thermal Resistance Natural
24.01°C/W
Yükseklik
18 mm
Fin Style
Vertical Fin

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