Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Seri
- BDN
- Uzunluk
- 1.610 40.89mm
- Package Cooled
- Assorted (BGA, LGA, CPU, ASIC...)
- Fin Style
- Pin Fin
- Tip
- Top Mount
- Attachment Method
- Thermal Tape, Adhesive (Included)
- Thermal Resistance Natural
- 13.50°C/W
- Height Off Base Height Of Fin
- 0.355 9.02mm
- Profile
- PIN FIN ARRAY
- Nem Hassasiyeti (MSL)
- 1 (Unlimited)
- Thermal Resistance Forced Air Flow
- 4.50°C/W @ 400 LFM
- Material
- Aluminum
- Montaj Stili
- Adhesive
- Yayın Yılı
- 2007
- Fabrika Tedarik Süresi
- 14 Weeks
- Shape
- Square, Pin Fins
- Device Used On
- IC
- Heatsink Material
- Aluminum
- Fin Orientation
- OMNIDIRECT
- Construction
- EXTRUDED
- Genişlik
- 1.610 40.89mm
- Material Finish
- Black Anodized
- Thermal Resistance
- 13.5 C/W
- Yükseklik
- 9.02 mm
- Parça Durumu
- Active
- RoHS Durumu
- RoHS Compliant
- Designed For
- BGA, PGA, PLCC, QFP