Volume pricing
- 1+ pcs$2.99
- 10+ pcs$2.83
- 100+ pcs$2.67
- 500+ pcs$2.51
Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Nem Hassasiyeti (MSL)
- 1 (Unlimited)
- Profile
- PIN FIN ARRAY
- Thermal Resistance Forced Air Flow
- 6.80°C/W @ 400 LFM
- Tip
- Top Mount
- Fin Style
- Pin Array
- Uzunluk
- 1.210 30.73mm
- Package Cooled
- Assorted (BGA, LGA, CPU, ASIC...)
- Seri
- BDN
- Height Off Base Height Of Fin
- 0.355 9.02mm
- Thermal Resistance Natural
- 19.60°C/W
- Attachment Method
- Thermal Tape, Adhesive (Included)
- Yükseklik
- 9.02 mm
- Designed For
- BGA, PGA, PLCC, QFP
- RoHS Durumu
- RoHS Compliant
- Parça Durumu
- Active
- Construction
- EXTRUDED
- Fin Orientation
- OMNIDIRECT
- Heatsink Material
- Aluminum
- Device Used On
- IC
- Shape
- Square, Pin Fins
- Fabrika Tedarik Süresi
- 14 Weeks
- Yayın Yılı
- 2004
- Montaj Stili
- Adhesive
- Material
- Aluminum
- Thermal Resistance
- 19.6 °C/W
- Material Finish
- Black Anodized
- Product Length
- 30.734 mm
- Genişlik
- 1.210 30.73mm