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C3 ChipZentronix
BDN11-3CB/A01

CTS Thermal Management Products

BDN11-3CB/A01

Heat Sinks

In StockRoHS: Compliant
Volume pricing
  • 1+ pcs$2.70
  • 10+ pcs$2.55
  • 100+ pcs$2.40
  • 500+ pcs$2.27

Shipping

Same-day dispatch from stock

Genuine parts

Verified sourcing

RoHS

Compliant

Support

Technical team support

Specifications

Main Purpose
DC/DC, Step Up
Yükseklik
9.02 mm
Parça Durumu
Active
Çıkış Gerilimi
48V
Designed For
BGA, PGA, PLCC, QFP
RoHS Durumu
RoHS Compliant
Outputs And Type
1, Non-Isolated
Board Type
Fully Populated
Material
Aluminum
Montaj Stili
Adhesive
Shape
Square, Pin Fins
Fabrika Tedarik Süresi
14 Weeks
Yayın Yılı
2007
Construction
EXTRUDED
Fin Orientation
OMNIDIRECT
Heatsink Material
Aluminum
Device Used On
IC
Frequency Switching
2MHz
Genişlik
1.110 28.19mm
Çıkış Akımı
280mA
Product Length
28.194 mm
Material Finish
Black Anodized
Regulator Topology
Boost
Thermal Resistance
20.9 °C/W
Profile
PIN FIN ARRAY
Voltageinput
10 V ~ 36 V
Nem Hassasiyeti (MSL)
1 (Unlimited)
Thermal Resistance Forced Air Flow
7.20°C/W @ 400 LFM
Utilized Ic Part
LT8362
Uzunluk
1.110 28.19mm
Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)
Seri
BDN
Fin Style
Pin Array
Supplied Contents
Board(s)
Tip
Top Mount
Attachment Method
Thermal Tape, Adhesive (Included)
Thermal Resistance Natural
20.90°C/W
Height Off Base Height Of Fin
0.355 9.02mm

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