Volume pricing
- 1+ pcs$3.65
- 10+ pcs$3.44
- 100+ pcs$3.24
- 500+ pcs$3.06
Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Yükseklik
- 9.02 mm
- Designed For
- BGA, PGA, PLCC, QFP
- RoHS Durumu
- RoHS Compliant
- Parça Durumu
- Active
- Device Cooled
- BGA/PGA/PLCC/QFP
- Heatsink Material
- Aluminum
- Fin Orientation
- OMNIDIRECT
- Construction
- EXTRUDED
- Device Used On
- IC
- Shape
- Square, Pin Fins
- Fabrika Tedarik Süresi
- 14 Weeks
- Yayın Yılı
- 2004
- Montaj Stili
- Adhesive
- Material
- Aluminum
- Thermal Resistance
- 26.4 °C/W
- Product Length
- 25.654 mm
- Material Finish
- Black Anodized
- Genişlik
- 1.010 25.65mm
- Nem Hassasiyeti (MSL)
- 1 (Unlimited)
- Finish
- Black Anodized
- Profile
- PIN FIN ARRAY
- Product Height Mm
- 9.017(mm)
- Rad Hardened
- No
- Product Length Mm
- 25.654(mm)
- Thermal Resistance Forced Air Flow
- 8.00°C/W @ 400 LFM
- Lead Free Status Rohs Status
- Lead free / RoHS Compliant
- Tip
- Top Mount
- Product Diameter Mm
- Not Required(mm)
- Fin Style
- Pin Array
- Package Cooled
- Assorted (BGA, LGA, CPU, ASIC...)
- Uzunluk
- 1.010 25.65mm
- Product Depth Mm
- 25.654(mm)
- Seri
- BDN
- Height Off Base Height Of Fin
- 0.355 9.02mm
- Thermal Resistance Natural
- 26.40°C/W
- Attachment Method
- Thermal Tape, Adhesive (Included)