833900T00000

Specifications

Power Dissipation Temperature Rise

2.0W @ 40°C

Material

Copper

Kurşunsuz

Lead Free

RoHS Durumu

RoHS Compliant

Height Off Base Height Of Fin

0.375 9.52mm

Yükseklik

9.5mm

Montaj

Surface Mount

Uzunluk

0.590 15.00mm

Package Cooled

TO-263 (D2Pak)

Genişlik

1.020 25.91mm

Attachment Method

SMD Pad

Shape

Rectangular, Fins

Nem Hassasiyeti (MSL)

Not Applicable

Thermal Resistance Forced Air Flow

5.00°C/W @ 400 LFM

Yayın Yılı

2006

Tip

Board Level

Parça Durumu

Obsolete

Material Finish

Tin