CMX868E2

Specifications

Operating Temperaturemin

-40 °C

Tepe Reflow Süresi (maks. sn)

40

Date Of Intro

1999-07-14

Package Body Material

PLASTIC/EPOXY

Supply Voltagenom

3 V

Package Code

TSSOP

Telecom Ic Type

MODEM

Qualification Status

Not Qualified

Supply Currentmax

11 mA

Part Package Code

TSSOP

Yüzey Montaj

YES

Operating Temperaturemax

85 °C

Ihs Manufacturer

CML MICROCIRCUITS LTD

Pin Sayısı

24

Kurşunsuz Kodu

Yes

Seated Heightmax

1.2 mm

Rohs Code

Yes

Number Of Terminals

24

Tepe Reflow Sıcaklığı (°C)

260

Jesd30 Code

R-PDSO-G24

JESD-609 Kodu

e3

Fonksiyon Sayısı

1

Terminal Adımı

0.65 mm

Part Life Cycle Code

Not Recommended

Genişlik

4.4 mm

Uzunluk

7.8 mm

Terminal Formu

GULL WING

Temperature Grade

INDUSTRIAL

Package Style

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Package Description

TSSOP-24

Data Rate

2 Mbps

REACH Uyumluluk Kodu

compliant

Package Equivalence Code

TSSOP24,.25

HTS Kodu

8542.39.00.01

Package Shape

RECTANGULAR

Terminal Pozisyonu

DUAL

Terminal Kaplaması

Matte Tin (Sn)