+90 533 300 32 01
C3 ChipZentronix

Chip Quik, Inc.

PA0061C

Solderless Breadboards

RoHS: Compliant

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RoHS

Compliant

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Specifications

Tip
QFN-16 to DIP-16 SMT Adapter
Ürün Durumu
Active
Yükseklik
1.6 mm
RoHS
Details
Paket
Bulk
Material
FR4 Epoxy Glass
Board Thickness
0.063 (1.60mm)
Spacing
2.2 mm
Package Accepted
QFN
Boyut / Ölçü
0.800 L x 0.400 W (20.32mm x 10.16mm)
Pitch
0.020 (0.50mm)
Temel Ürün No
PA0061
Contact Materials
Gold
Proto Board Type
SMD to DIP
Genişlik
10.16 mm
Uzunluk
20.32 mm
Seri
Proto-Advantage
Pozisyon Sayısı
16

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