+90 533 300 32 01
C3 ChipZentronix

Chip Quik, Inc.

PA0035C

Solderless Breadboards

RoHS: Compliant

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Same-day dispatch from stock

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RoHS

Compliant

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Specifications

Spacing
3.1 mm
Package Accepted
TSSOP
Boyut / Ölçü
1.000 L x 0.400 W (25.40mm x 10.16mm)
Tip
TSSOP-20 to DIP-20 SMT Adapter
Ürün Durumu
Active
Yükseklik
1.6 mm
Paket
Bulk
RoHS
Details
Material
FR4 Epoxy Glass
Board Thickness
0.063 (1.60mm)
Proto Board Type
SMD to DIP
Genişlik
10.16 mm
Uzunluk
25.4 mm
Seri
Proto-Advantage
Pozisyon Sayısı
20
Pitch
0.026 (0.65mm)
Temel Ürün No
PA0035
Contact Materials
Gold

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