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C3 ChipZentronix

Chip Quik, Inc.

PA0032C

Solderless Breadboards

RoHS: Compliant

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RoHS

Compliant

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Specifications

Board Thickness
0.063 (1.60mm)
Yükseklik
1.6 mm
Temel Ürün No
PA0032
Contact Materials
Gold
Material
FR4 Epoxy Glass
Boyut / Ölçü
0.400 L x 0.400 W (10.16mm x 10.16mm)
Pozisyon Sayısı
8
Proto Board Type
SMD to DIP
Seri
Proto-Advantage
Genişlik
10.16 mm
Pitch
0.026 (0.65mm)
Package Accepted
TSSOP
Ürün Durumu
Active
RoHS
Details
Spacing
3.1 mm
Tip
TSSOP-8 to DIP-8 SMT Adapter
Paket
Bulk
Uzunluk
10.16 mm

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