+90 533 300 32 01
C3 ChipZentronix

Chip Quik, Inc.

PA0026C

Solderless Breadboards

RoHS: Compliant

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Compliant

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Specifications

Boyut / Ölçü
0.400 L x 0.400 W (10.16mm x 10.16mm)
Material
FR4 Epoxy Glass
Contact Materials
Gold
Temel Ürün No
PA0026
Yükseklik
1.6 mm
Board Thickness
0.063 (1.60mm)
Genişlik
10.16 mm
Proto Board Type
SMD to DIP
Seri
Proto-Advantage
Pozisyon Sayısı
8
RoHS
Details
Ürün Durumu
Active
Package Accepted
MSOP, uMAX, uSOP
Pitch
0.026 (0.65mm)
Uzunluk
10.16 mm
Paket
Bulk
Tip
uMAX-8/uSOP-8/MSOP-8 to DIP-8 SMT Adapter
Spacing
2.7 mm

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